Axera Delivers Keynote Speech at a Forum During the 2023 World Semiconductor Conference
The 5th World Semiconductor Conference and Nanjing International Semiconductor Expo took place successfully from July 19 to 21, 2023. Concurrently with the conference on the afternoon of July 19, the 2023 Forum on the Innovation-driven Development of the IC Industry in the Yangtze River Delta was held. Xing Zhang, Senior Director of Axera, attended the forum and delivered a keynote speech titled “The Development of AI-ISP and Terminal AI.”
The conference, co-hosted by the Jiangsu Provincial Department of Industry and Information Technology and the Nanjing Jiangbei New Area Administrative Committee, was themed “Chips as the Link to a New Future.” It aimed to present a premier event for the global industry, combining industry exchange, channel collaboration, and resource integration.
At the forum, Zhang introduced the architectural innovations of the Axera Zhimou AI-ISP : “Currently, the Axera Zhimou AI-ISP enhances the four most critical modules in the ISP pipeline—HDR, 3DNR, RLTM, and Demosaic—through AI empowerment. By continually improving these modules via AI training, we are breaking the ‘ceiling’ of traditional ISP imaging.”
In practical applications, the Axera Zhimou AI-ISP improves performance through iterating software models, allowing for quick upgrades to the image quality. This means that Axera can cover different scenarios and markets with a single chip, reducing the overall cost of AI applications and significantly boosting productivity.
Currently, Axera is not only continuing to optimize and iterate the AI algorithms for HDR, 3DNR, RLTM, and Demosaic but also exploring enhancements and AI integration for other modules in the traditional ISP pipeline. Additionally, another core self-developed technology by Axera, the Axera Tongyuan NPU, excels in computational performance, further accelerating the implementation of AI.
In 2023, the surge in large models has advanced AI development into a new phase. Axera believes that, due to the high demands for real-time image processing, reliability, privacy protection, and security, AI will gradually shift from the cloud to edge and terminal devices. This transition will also increase the demands on computing power at the edge and terminal.
Axera’s third- and fourth-generation chips, equipped with the Axera Tongyuan NPU, support Transformer models. As large models continue to evolve, Axera is actively exploring ways to achieve better AI-ISP results through these models. By leveraging technological innovation, Axera aims to address key industry challenges such as low-light and high-dynamic-range scenarios. The Axera Zhimou AI-ISP, which powers new product categories like the black-light full-color camera, is unlocking new visual experiences for users and may lead to a new era in imaging technology.
